Effect of stacking sequence of the bonded composite patch on repair performance

dc.contributor.authorBenderdouche, Nouredine
dc.contributor.authorBeloufa, Hadja Imane
dc.contributor.authorOuinas, Djamel
dc.contributor.authorTarfaoui, Mostapha
dc.date.accessioned2019-01-21T10:55:51Z
dc.date.available2019-01-21T10:55:51Z
dc.date.issued2016-01-25
dc.description.abstractIn this study, the three-dimens ional finite element method is u sed to determine the stress intensity factor in Mode I and Mixed mode of a centered crack i n an aluminum specimen repaired by a composite patch using contour integral. Various mesh densities were used to achieve convergence of the results. The effect of adhesive j oint thickness, patch thicknes s, patch-specimen interface and layer sequence on the SIF was highlighted. The results obtained show that the patch-specimen contact surface is the best indicator of the deceleration of crack propagation, and hence o f SIF reduction. Thus, the reduction in rigidity of the patch especially at adhesive layer-patch interface, allo ws the lowering of shear and normal stresses in the adhesive joint. The choice o f the orientation of the adhesi ve layer-patch contact is important in the evolution of the shear and peel stresses. The patch will be mor e beneficial and effective while using the cross-layer on the contact surface.en_US
dc.identifier.urihttp://e-biblio.univ-mosta.dz/handle/123456789/8779
dc.publisherStructural Engineering and Mechanicsen_US
dc.subjectcomposite bonded patch; sequence of ply; adjacent cross-layer; contact surface of repair; stress intensity factor (SIF); finite element analysisen_US
dc.titleEffect of stacking sequence of the bonded composite patch on repair performanceen_US
dc.typeArticleen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Beloufa.pdf
Size:
474 KB
Format:
Adobe Portable Document Format
Description:

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: