Effet Combiné du Cuivre et du Plomb sur la Germination et la Croissance du Pois chiche « Cicer arietinum L »

Abstract

In order to test the sensitivity of chickpea (Cicer arietinum L) against toxicity to copper and copper combined with lead, the evaluation of germination power and pot growth on agronomic soil was carried out by appropriate tests. The seed germination test in Petri dishes on filter paper as well as the evaluation of the growth parameters namely, the biometrics of the stems and roots, number of leaves were evaluated. The results reveal that copper at different concentrations (100, 300 and 500ppm) does not affect the germination of Cicer arietinum seeds. (a maximum germination rate of 92%). On the other hand, the effect of copper combined with lead, reduced the germination power with a maximum rate of 85% against 88% in the control. The results of the biometric average of the stems show that the plant is sensitive to stress of Cu and copper combined with lead decreased the sensitivity caused by Cu but the growth of the stems remains always affected, Copper stress did not affect leaf growth. This resistance is attenuated with respect to the combined test compared to the Cu test Evaluation of root biometrics indicates positively significant growth against Cu stress for concentrations of 100 ppm (13.5) followed by 300 ppm (15cm) versus 8 cm in the control. However, root growth is sensitive to high Cu concentrations (500ppm). The combination of copper and lead reduced the growth of the root system of Cicer arietinum L whose average biometry is 6.5 cm against 8 cm in the control